Huawei Files Patent for New 2 nm Chip Process
Huawei has filed an unexpected patent application for the production of next-generation 2 nm chips, showcasing its determination to advance semiconductor manufacturing despite sanctions. The patent reveals Huawei’s plan to achieve this milestone solely using DUV lithography equipment and working within the limitations imposed by restricted access to EUV machines.
📌 Key Takeaways
✓Huawei patents new 2 nm chip process
✓Uses only DUV lithography equipment
✓Aims to reduce external dependencies
✓Plans transition from N+3 to 2 nm node
New Chip Manufacturing ApproachThe document outlines an advanced multi-pattern technique that could help Huawei and its production partner SMIC reach a 21 nm metal pitch, which is equivalent to TSMC and Samsung’s current 2 nm processes based on EUV technolog...
