Huawei plans to issue 4 billion bonds, the second bond issue this year2021-03-02
On March 1, Huawei Investment Holdings Co., Ltd.’s second phase of 2021 total 4 billion yuan and a 3-year period. The release date is between 3 and 4 March. On January 26 this year, Huawei released the first phase of 2021 medium term bonds with the same amount of 4 billion yuan ($ 618,027,840).
Huawei issued four medium-term bonds totaling 9 billion yuan ($ 1,390,648,500) in 2020. Combined with a total of 8 billion yuan ($ 1,236,074,800) medium term bond issues in 2019 and 2021, Huawei expects domestic funding to reach 23 billion yuan ($ 3,553,715,050) in the past three years.
Regarding Huawei’s debt issue, Ren Zhengfei told the media in 2019:
“In the past, Huawei was heavily financed by Western banks. Now the financing channels of Western banks are slowly not smooth. Huawei will try to switch to local banks for financing. Since there is no repayment problem and our funds are relatively abundant, they will lend as much as they want to give. If there is more money, to universities. We hope to provide more support to scientific research institutions and standards organizations to support the development of the world. It cannot narrowly defend its own interests. “